Finite strain stress fields near the tip of an interface crack between a soft incompressible elastic material and a rigid substrate
Department of Theoretical and Applied Mechanics, Cornell University, 322 Thurston Hall, 14853, Ithaca, NY, USA
* e-mail: firstname.lastname@example.org
Accepted: 10 March 2009
Published online: 13 May 2009
We present a numerical study of finite strain stress fields near the tip of an interface crack between a rigid substrate and an incompressible hyperelastic solid using the finite element method (FEM). The finite element (FE) simulations make use of a remeshing scheme to overcome mesh distortion. Analyses are carried out by assuming that the crack tip is either pinned, i.e., the elastic material is perfectly bonded (no slip) to the rigid substrate, or the crack lies on a frictionless interface. We focus on a material which hardens exponentially. To explore the effect of geometric constraint on the near tip stress fields, simulations are carried out under plane stress and plane strain conditions. For both the frictionless interface and the pinned crack under plane stress deformation, we found that the true stress field directly ahead of the crack tip is dominated by the normal opening stress and the crack face opens up smoothly. This is also true for an interface crack along a frictionless boundary in plane strain deformation. However, for a pinned interface crack under plane strain deformation, the true opening normal stress is found to be lower than the shear stress and the transverse normal stress. Also, the crack opening profile for a pinned crack under plane strain deformation is completely different from those seen in plane stress and in plane strain (frictionless interface). The crack face flips over and the tip angle is almost tangential to the interface. Our results suggest that interface friction can play a very important role in interfacial fracture of soft materials on hard substrates.
PACS: 62.20.mm Fracture – / 62.20.mt Cracks – / 62.20.D- Elasticity –
© EDP Sciences, SIF, Springer-Verlag Berlin Heidelberg, 2009