https://doi.org/10.1140/epje/i2005-10078-6
Regular Article
Modeling on debonding dynamics of pressure-sensitive adhesives
1
CREST, Japan Science and Technology Agency (JST), Japan
2
Department of Applied Physics, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, 113-8656, Japan
* e-mail: yamaguchi@rheo.t.u-tokyo.ac.jp
Received:
28
December
2005
Accepted:
8
March
2006
Published online:
21
April
2006
We propose a simple mechanical model describing viscoelasticity and cavitation during the debonding process in pressure-sensitive adhesives (PSA). Our calculation qualitatively reproduces typical stress-strain curves in the probe-tack test, such as the steep stress maxima and the following plateau region. It is shown that in the thin-film geometry the stress-strain curve is essentially determined by the cavities created by the large negative pressure. Effects of pre-existent air bubbles due to surface roughness are also discussed.
PACS: 47.55.dp Cavitation and boiling – / 68.35.Np Adhesion –
© EDP Sciences, Società Italiana di Fisica and Springer-Verlag, 2006