Eur. Phys. J. E (2006) 20: 7-17
https://doi.org/10.1140/epje/i2005-10078-6

Regular Article

Modeling on debonding dynamics of pressure-sensitive adhesives

¹ CREST, Japan Science and Technology Agency (JST), Japan
² Department of Applied Physics, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, 113-8656, Japan

^* e-mail: yamaguchi@rheo.t.u-tokyo.ac.jp

Received: 28 December 2005
Accepted: 8 March 2006
Published online: 21 April 2006

Abstract

We propose a simple mechanical model describing viscoelasticity and cavitation during the debonding process in pressure-sensitive adhesives (PSA). Our calculation qualitatively reproduces typical stress-strain curves in the probe-tack test, such as the steep stress maxima and the following plateau region. It is shown that in the thin-film geometry the stress-strain curve is essentially determined by the cavities created by the large negative pressure. Effects of pre-existent air bubbles due to surface roughness are also discussed.