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Modeling on debonding dynamics of pressure-sensitive adhesives
T. Yamaguchi1,2*, H. Morita1 and M. Doi1,2
CREST, Japan Science and Technology Agency (JST), Japan
2 Department of Applied Physics, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, 113-8656, Japan
* e-mail: email@example.com
Accepted: 8 March 2006
Published online: 21 April 2006
We propose a simple mechanical model describing viscoelasticity and cavitation during the debonding process in pressure-sensitive adhesives (PSA). Our calculation qualitatively reproduces typical stress-strain curves in the probe-tack test, such as the steep stress maxima and the following plateau region. It is shown that in the thin-film geometry the stress-strain curve is essentially determined by the cavities created by the large negative pressure. Effects of pre-existent air bubbles due to surface roughness are also discussed.
PACS: 47.55.dp Cavitation and boiling – / 68.35.Np Adhesion –
© EDP Sciences, Società Italiana di Fisica and Springer-Verlag, 2006