Eur. Phys. J. E 20, 7-17 (2006)
DOI: 10.1140/epje/i2005-10078-6

Modeling on debonding dynamics of pressure-sensitive adhesives

T. Yamaguchi^{1, 2}, H. Morita¹ and M. Doi<sup>1, 2

1</sup>  CREST, Japan Science and Technology Agency (JST), Japan
²  Department of Applied Physics, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, 113-8656, Japan

yamaguchi@rheo.t.u-tokyo.ac.jp

(Received 28 December 2005 / Published online 21 April 2006)

Abstract

We propose a simple mechanical model describing viscoelasticity and cavitation during the debonding process in pressure-sensitive adhesives (PSA). Our calculation qualitatively reproduces typical stress-strain curves in the probe-tack test, such as the steep stress maxima and the following plateau region. It is shown that in the thin-film geometry the stress-strain curve is essentially determined by the cavities created by the large negative pressure. Effects of pre-existent air bubbles due to surface roughness are also discussed.

PACS
47.55.dp - Cavitation and boiling.
68.35.Np - Adhesion.

© EDP Sciences, Società Italiana di Fisica, Springer-Verlag 2006