Modeling on debonding dynamics of pressure-sensitive adhesivesT. Yamaguchi1, 2, H. Morita1 and M. Doi1, 2
1 CREST, Japan Science and Technology Agency (JST), Japan
2 Department of Applied Physics, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, 113-8656, Japan
(Received 28 December 2005 / Published online 21 April 2006)
We propose a simple mechanical model describing viscoelasticity and cavitation during the debonding process in pressure-sensitive adhesives (PSA). Our calculation qualitatively reproduces typical stress-strain curves in the probe-tack test, such as the steep stress maxima and the following plateau region. It is shown that in the thin-film geometry the stress-strain curve is essentially determined by the cavities created by the large negative pressure. Effects of pre-existent air bubbles due to surface roughness are also discussed.PACS
47.55.dp - Cavitation and boiling.
68.35.Np - Adhesion.
© EDP Sciences, Società Italiana di Fisica, Springer-Verlag 2006